Forge Nano Inc.
The University of Colorado Connection
is an advanced materials company based on Atomic Layer Deposition (ALD) nanocoating technology. The company merged with ALD NanoSolutions in 2020, an earlier spinout founded in 2001 by CU ¶¶Òõ´«Ã½ÔÚÏß faculty, including Ìý(CU ¶¶Òõ´«Ã½ÔÚÏß Chemical and Biological Engineering) and Steven M. George (CU ¶¶Òõ´«Ã½ÔÚÏß Chemistry).Ìý
ALD NanoSolutions developed innovative Particle ALD technology for precision coating of powders at the atomic scale, with numerous applications in batteries and other materials. This technology received early-stage funding through a partnership between CU ¶¶Òõ´«Ã½ÔÚÏß and the Colorado Office of Economic Development and International Trade (OEDIT), which later became CU's Lab Venture Challenge (LVC). Forge Nano, which also originated from CU ¶¶Òõ´«Ã½ÔÚÏß-related research, combined forces with ALD NanoSolutions to consolidate expertise and rapidly scale the atomic-level manufacturing of materials. Forge Nano continues to expand its technology globally, using its proprietary Atomic ArmorTM platform to produce high-performance lithium-ion batteries and commercial semiconductor equipment.
Funding Status and Investment Opportunities
- Industry Applications: Advanced Materials, Environment and Sustainability, Cleantech, Hardware and Instrumentation, Semiconductors, Manufacturing
- Funding Stage: Series B Round or beyond
In the News
- Forge Nano to go public via $1.6B SPAC, becoming CU ¶¶Òõ´«Ã½ÔÚÏß’s 11th unicorn (2026)
- (2026)
- (2026)
- Forge Nano secures $40M to scale U.S. battery manufacturing and commercial semiconductor equipment businesses (2025)
- (2024)
- CU ¶¶Òõ´«Ã½ÔÚÏß engineering grad builds world-leading materials science company (2023)
- Spinoff company is all in the CU ¶¶Òõ´«Ã½ÔÚÏß family (2017)
- CU spinoff ALD Nanosolutions reports successful year (2016)
- Spinoff company discovers new opportunities for nanomaterials (2016)
- CU-¶¶Òõ´«Ã½ÔÚÏß chemical and biological engineers help fuel economy with 10 entrepreneurial startups (2011)
Venture Partners Programs​
*This technology received early-stage funding through a partnership between CU ¶¶Òõ´«Ã½ÔÚÏß and the Colorado Office of Economic Development and International Trade (OEDIT), which later became the Lab Venture Challenge (LVC).Ìý
ÌýÌý ÌýThis page was last updated on Dec. 12, 2025. Please email vpnews@colorado.edu for corrections or updates
The Insider Investor eNewsletter
Media Inquiries
For marketing inquiries and news tips, contact Daniel Leonard,Ìýsenior marketing and communications specialist for Venture Partners at CU ¶¶Òõ´«Ã½ÔÚÏß.
For media inquiries, please visit .